| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-sized inexpensive electronic component mounting device that is high in productivity and free from the contamination of components and does not require frequent cleaning (can be maintained easily), and to provide a method of mounting electronic component. SOLUTION: The electronic component mounting device which joins a joint object and an object to be joined to each other is provided with a plasma generating device which generates a plasma gas under the atmospheric pressure or its vicinity, a plasma supplying device which supplies the generated plasma gas to the junction between the joint object and object to be joined and injects the gas, and a cleaning/joining device which washes the surfaces of the junctions of both objects with the injected plasma gas under the atmospheric pressure or its vicinity and, almost simultaneously, joins the junctions to each other. COPYRIGHT: (C)2004,JPO&NCIPI
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