| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate, electronic component, and mounting structural body which can prevent unwanted short circuits and the cracking of solder. SOLUTION: Deformation absorption holes 5 and 13 are formed in the peripheral region of electrode insertion holes 4 and 12 of a substrate 2 and of a seat 8 which is a constituent part of a coil 3, respectively. The deformation absorption holes 5 and 13 are extended in the thickness direction through the substrate 2 and the seat 8, respectively, and permit the deformation of the peripheral region of the electrode insertion holes 4 and 12. The deformation absorption holes 5 are formed in such a size that a loss head at the time of assuming that solder which has reached the deformation absorption holes flows down the deformation absorption holes 5 may be larger than that of the solder which has reached the deformation absorption holes, preventing the solder from entering one end of the deformation absorption holes 5 and leaving the other end, and thereby avoiding unwanted short circuits. Moreover, since the displacement caused by a difference in a coefficient of thermal expansion between the substrate 2 and the seat 8 is permitted, cracking occurring in the solder is prevented. COPYRIGHT: (C)2004,JPO&NCIPI
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