发明名称 |
COOPER PASTE AND PRINTED WIRING BOARD USING IT |
摘要 |
PROBLEM TO BE SOLVED: To provide copper paste with excellent filling capability for a via hole of a printed wiring board or the like and having low viscosity; and to provide a printed wiring board using the copper paste. SOLUTION: This copper paste comprises an organic vehicle and copper powder and is used for forming a conductor of the printed wiring board. The copper powder is prepared by applying a surface treatment by a carboxylic acid-containing organic solvent, and by applying a re-powdering treatment by using a wind power circulator. The copper powder used in this case is provided with the following respective powder characteristics (1)-(4): (1) the average particle diameter D<SB>50</SB>by a laser diffraction scatter type particle size distribution measurement method of the copper powder is 0.7-10.0μm; (2) the value of the degree of aggregation expressed by D<SB>50</SB>/D<SB>IA</SB>by using the average particle diameter D<SB>50</SB>by the laser diffraction scatter type particle size distribution measurement method of the copper powder and the average particle diameter D<SB>IA</SB>obtained by an image analysis is 1.2-1.7; and (3) the specific surface area of the copper powder is 0.10-0.62 m<SP>2</SP>/g. COPYRIGHT: (C)2004,JPO&NCIPI
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申请公布号 |
JP2004227961(A) |
申请公布日期 |
2004.08.12 |
申请号 |
JP20030015445 |
申请日期 |
2003.01.23 |
申请人 |
MITSUI MINING & SMELTING CO LTD |
发明人 |
SAKAGAMI TAKAHIKO;SASAKI TAKUYA;UWAZUMI YOSHIAKI;YOSHIMARU KATSUHIKO;SHIMAMURA HIROYUKI |
分类号 |
H05K1/09;H01B1/22;(IPC1-7):H01B1/22 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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