| 摘要 |
<p>A high-frequency circuit package and its mounting configuration capable of easily mounting on a printed circuit board and case and obtaining a preferable high-frequency characteristic. On the upper surface of a package gland substrate (11) having an installation space for mounting a high-frequency circuit element (15), a dielectric substrate (12) having electrode terminals (14a, 14b) to be connected to the high frequency circuit element (15) is arranged. The package gland substrate (11) has an upper surface wider than the dielectric substrate (12). Moreover, for such a high-frequency circuit package (10A), the part of the dielectric substrate (12) is inserted into an opening (35) of substantially the same size as the dielectric substrate provided on a flexible printed circuit board (30). The upper surface of the package gland substrate (11) is directly attached (by soldering) to a grounding conductor (33) at the back of the printed circuit board in the periphery of the opening (35).</p> |
