发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND ELECTRO-OPTICAL DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device that comprises a semiconductor film having an LDD structure capable of easily providing the configuration with which concentration of electric field near a drain region is further prevented. SOLUTION: The method for manufacturing the semiconductor device includes a process where a semiconductor film 22 crystallized on a substrate 10 is formed in a prescribed pattern, a process where an insulating film 31 is formed on the semiconductor film 22, a process where a mask 39 for selectively implanting impurity ion into the semiconductor film 22 is formed on the insulating film 31, a process for implanting the impurity ion into the semiconductor film 22, and a process for peeling a mask 22. The peeling process with the mask 22 is performed by ashing and done under the condition that contains such component as can etch the insulating film 31. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004228197(A) 申请公布日期 2004.08.12
申请号 JP20030012071 申请日期 2003.01.21
申请人 SEIKO EPSON CORP 发明人 KOSHIHARA TAKESHI
分类号 G02F1/1368;H01L21/20;H01L21/266;H01L21/3065;H01L21/336;H01L29/786;(IPC1-7):H01L21/336;G02F1/136;H01L21/306 主分类号 G02F1/1368
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