| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding method which enables the adjustment of the level of a floor surface while ensuring the strength of adhesion to a bonding object to be bonded onto a level adjusting layer, without performing roughening by a disk sander etc. SOLUTION: The level adjusting layer 20 is formed on the surface of an existing building floor 6 by using a resin for an adhesive, and cured by being covered with a vinyl sheet. After the curing of the layer 20, the adhesive 24 is applied to its surface, and the a block 10 for constituting an earthquake-resisting wall is bonded to its surface. Any one of an epoxy resin, an acrylic resin and a urethane resin is used as a resin which constitutes the adhesive 24 and the layer 20. Preferably, the layer 20 is composed of a resin which is made from the same material as a material for the adhesive 24. COPYRIGHT: (C)2004,JPO&NCIPI
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