发明名称 Molding compound
摘要 There is disclosed a molding compound. The molding compound preferably includes a macrocyclic oligoester that reacts with itself, a secondary compound or another macrocyclic oligoester during molding of the molding compound. Exemplary secondary compounds include a cyclic ester, a dihydroxyl-functionalized polymer or the like.
申请公布号 US2004155380(A1) 申请公布日期 2004.08.12
申请号 US20030723096 申请日期 2003.11.26
申请人 DOW GLOBAL TECHNOLOGIES INC. 发明人 KENDALL JOHN E.;REX GARY C.;SEATS ROBERT L.;BANK DAVID H.;DION ROBERT P.
分类号 B29C67/24;B29C70/46;(IPC1-7):B29C71/00 主分类号 B29C67/24
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