发明名称 Ge-Cr ALLOY SPUTTERING TARGET AND PROCESS FOR PRODUCING THE SAME
摘要 <p>A Ge-Cr alloy sputtering target comprising 5 to 50 at% of Cr characterized in that the Ge-Cr alloy sputtering target has a relative density of 95% or higher. There is further provided a process for producing the Ge-Cr alloy sputtering target, characterized in that a Cr powder of 75 mum or less size after flat sieving and a Ge powder of 250 mum or less size after sieving, the Ge powder having a BET specific surface area of 0.4 m&lt;2&gt;/g or less, are uniformly dispersed and mixed together and thereafter sintered. The Ge-Cr alloy sputtering target and process for producing the same would enable not only suppressing the dispersions of film forming speed and composition of a GeCrN layer provided by reactive sputtering as an interlayer between the recording layer and protection layer of phase change optical disc but also increasing product yield.</p>
申请公布号 WO2004067798(A1) 申请公布日期 2004.08.12
申请号 WO2003JP12660 申请日期 2003.10.02
申请人 NIKKO MATERIALS CO., LTD.;TAKAMI, HIDEO;AJIMA, HIROHISA 发明人 TAKAMI, HIDEO;AJIMA, HIROHISA
分类号 B22F1/00;B22F3/10;C22C1/04;C22C28/00;C22C30/00;C23C14/34;G11B5/851;G11B7/243;G11B7/254;G11B7/257;G11B7/26;(IPC1-7):C23C14/34 主分类号 B22F1/00
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