发明名称 |
Ge-Cr ALLOY SPUTTERING TARGET AND PROCESS FOR PRODUCING THE SAME |
摘要 |
<p>A Ge-Cr alloy sputtering target comprising 5 to 50 at% of Cr characterized in that the Ge-Cr alloy sputtering target has a relative density of 95% or higher. There is further provided a process for producing the Ge-Cr alloy sputtering target, characterized in that a Cr powder of 75 mum or less size after flat sieving and a Ge powder of 250 mum or less size after sieving, the Ge powder having a BET specific surface area of 0.4 m<2>/g or less, are uniformly dispersed and mixed together and thereafter sintered. The Ge-Cr alloy sputtering target and process for producing the same would enable not only suppressing the dispersions of film forming speed and composition of a GeCrN layer provided by reactive sputtering as an interlayer between the recording layer and protection layer of phase change optical disc but also increasing product yield.</p> |
申请公布号 |
WO2004067798(A1) |
申请公布日期 |
2004.08.12 |
申请号 |
WO2003JP12660 |
申请日期 |
2003.10.02 |
申请人 |
NIKKO MATERIALS CO., LTD.;TAKAMI, HIDEO;AJIMA, HIROHISA |
发明人 |
TAKAMI, HIDEO;AJIMA, HIROHISA |
分类号 |
B22F1/00;B22F3/10;C22C1/04;C22C28/00;C22C30/00;C23C14/34;G11B5/851;G11B7/243;G11B7/254;G11B7/257;G11B7/26;(IPC1-7):C23C14/34 |
主分类号 |
B22F1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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