COPPER FOIL FOR HIGH FREQUENCY CIRCUIT, METHOD OF PRODUCTION AND APPARATUS FOR PRODUCTION OF SAME, AND HIGH FREQUENCY CIRCUIT USING COPPER FOIL

摘要

PURPOSE: To provide a copper foil reducing transmission loss at a high frequency when used as a material for a high frequency circuit and excellent in bond strength with a resin substrate, a method of production and apparatus for production for the same, and a high frequency circuit using the same. CONSTITUTION: A power feed unit(3) for passing current through the electrolytic drum(1) serves as the cathode. A first plating tank(4) is filled with an electrolytic solution (A1) causing deposition of the electrodeposited foil serving as the granular layer on the surface of the electrolytic drum(1). An anode(5) is provided in the first plating tank(4). A second plating tank(6) is filled with an electrolytic solution (A2) for causing deposition of the electrolytic layer serving as the columnar layer on the granular layer formed on the surface of the electrolytic drum. The electrolytic drum(1) is made to turn so as to successively pass through the first plating tank(4) and the second plating tank(6) in that order. The copper foil(10) deposited on the electrolytic drum(1) is peeled off from the electrolytic drum(1) when emerging from the second plating tank(6), whereby the final product is obtained. In this way, by rotating the electrolytic drum(1), it is possible to continuously produce a copper foil comprised of a granular layer on which a columnar layer is formed. Further, by switching the order of the electrolytic solutions (A1) and (A2), it is possible to form a copper foil comprised of a columnar layer on which a granular layer is formed.