| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize a camera module for portable equipment into a chip size, with a reduced manufacturing cost. SOLUTION: An image sensor wafer 100 constituted of a plurality of image sensor chips 20, and a lens array 102 having a plurality of lenses 10 of equivalent size to image sensor chips 20 disposed and formed into a wafer are prepared. A cutting groove 13 is formed on the lens array 102. Thereafter, the lens array 102 is pasted on the surface of the image sensor wafer 100. Thereafter, by both the image sensor chips 20 and the lens array 102 along the cutting groove 13 cut into discrete camera modules 200. COPYRIGHT: (C)2004,JPO&NCIPI
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