发明名称 WIRING CONDUIT STRUCTURE OF PARALLEL LINK MECHANISM
摘要 PROBLEM TO BE SOLVED: To provide a wiring conduit structure for improving durability of wiring conduits by smoothly laying the wiring conduits by following movement of a mobile body in a parallel link mechanism. SOLUTION: The wiring conduits 11 are fixed to a supporting plate 9 stood at a position slightly away from the center on an upper surface of a ceiling part 7. Subsequently, the wiring conduits 11 are led with play of some degree to a closest universal joint 5 not to be obstacles for oscillating the universal joint 5 and changing the position. After the wiring conduits 11 led to the universal joint 5 are fixed to a side surface of an inside ring in the universal joint 5 by a clamp member and are led to a machine, the wiring conduits 11 are fixed on a connecting sleeve 18 of a ball screw 4 with play of some degree not to be obstacles for extending and contracting the ball screw 4 by the clamp member 19. The wiring conduits 11 are connected to a spindle head 2 with play of some degree not to be obstacles for oscillating the ball screw 4 and changing the position. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004223635(A) 申请公布日期 2004.08.12
申请号 JP20030012653 申请日期 2003.01.21
申请人 OKUMA CORP 发明人 ANDO TOMOHARU
分类号 B23Q1/00;B25J11/00;B25J17/02;B25J19/00;(IPC1-7):B25J19/00;B23Q1/44 主分类号 B23Q1/00
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