<p>A heating apparatus (101), comprising a hot plate (2) heating a heated substrate (10) by radiation, lift pins (5) liftably disposed in through-holes (6) formed in the hot plate and lifting the heated substrate, and a proximity pin (11) fixed to the hot plate and holding the heated substrate so as to be separated from the hot plate while the heated substrate is heated. Heat reducing parts (13, 7) reducing radiant heat are installed in the hot plate around the proximity pin or around the through-holes.</p>
申请公布号
WO2004068227(A1)
申请公布日期
2004.08.12
申请号
WO2004JP00828
申请日期
2004.01.29
申请人
NISSHA PRINTING CO., LTD.;YOTSUYA, KENJI;HASHIMURA, YASUHIRO;AKAI, TAKAHIRO;OKUDA, TOSHIAKI;SATO, KOJI
发明人
YOTSUYA, KENJI;HASHIMURA, YASUHIRO;AKAI, TAKAHIRO;OKUDA, TOSHIAKI;SATO, KOJI