DICING APPARATUS AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE TO PERFORM PRECISE DICING PROCESS FOR PARTIALLY DICING WAFER TO WHICH SUBSTRATE IS BONDED

摘要

PURPOSE: A dicing apparatus is provided to perform a precise dicing process for partially dicing a wafer to which a substrate is bonded by properly correcting the position of a rotation blade. CONSTITUTION: A wafer is mounted on a wafer stage(10). A blade(11) is disposed on the wafer stage. A light source irradiates detection light to the inside of a cutting groove which is formed in a dicing line region of the wafer by the blade. A recognition camera(15) detects the shape of the cutting groove based upon the reflection light from the cutting groove. A position correcting unit corrects the position of the blade based upon the detection result of the recognition camera so that the center line of the cutting groove is located in a predetermined position and the depth of the cutting groove becomes a predetermined value.