| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an IC tag capable of surely breaking a built-in electronic circuit when the IC tag stuck to an article is peeled. <P>SOLUTION: This IC tag comprises a first adhesive layer laminated on a base material sheet. An electronic circuit consisting of a circuit line and an IC chip connected to the electronic circuit are provided on the surface of the first adhesive layer, and at least one disconnection portion present in the circuit line is connected through a flat conductive resin layer, or an electronic circuit formed of a circuit line and a jumper wiring part and an IC chip connected to the electronic circuit are provided on the surface of the first adhesive layer, and the jumper wiring part is connected to the circuit line through a flat conductive resin layer 3 mm or more in length, whereby a second adhesive layer covering the electronic circuit and IC chip is laminated on the surface of the first layer. A release agent layer is further partially provided in a position corresponding to a circuit surface formed by the electronic circuit and IC chip in the interface between the base material sheet and the first adhesive layer. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
