发明名称 PLASMA TREATMENT METHOD AND PLASMA TREATMENT DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a plasma treatment method in which stable glow discharge plasma is formed in a wide range under pressure near the atmospheric pressure and a treatment object of even a metal member of large area can be treated at the same time for the whole surface, and which has high productivity, and a plasma treatment device. <P>SOLUTION: In the plasma treatment method, a dielectric layer is installed on the surface of a metal substrate 3 having a plurality of through holes 2, and a plurality of metal substrates 3 are overlapped so that the through holes 2 may correspond thereto to form an electrode 4, and it comprises a step of supplying gas of pressure near the atmospheric pressure toward the inside of the through holes 2, a step of impressing a voltage between the metal substrates 3 and making the gas in the through hole 2 into the plasma, and a step of applying surface treatment on the treatment object member M placed opposed to the vicinity of the electrode 4 by utilizing the plasma. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004227990(A) 申请公布日期 2004.08.12
申请号 JP20030016106 申请日期 2003.01.24
申请人 TACHIBANA KUNIHIDE;HITACHI METALS LTD 发明人 TACHIBANA KUNIHIDE;INOUE RYOJI
分类号 H05H1/24;H01J9/02;H01L21/205;H01L21/3065 主分类号 H05H1/24
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