发明名称 BACKUP SHEET FOR BORING THROUGH-HOLE WITH LASER
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a backup sheet which is used for primarily boring a well-shaped through-hole of small diameter in a copper-plated board by irradiating it with a carbon dioxide gas laser, formed by depositing an adhesive single layer or a resin layer loaded with an adhesive agent that is adhesive at a room temperature on a metal foil to serve as the backup sheet, pasted on the copper-plated board at a room temperature so as to prevent the copper-plated board from warping, and can be easily separated at separation. <P>SOLUTION: After the adhesive single layer or the resin layer is formed on the metal foil first, then the adhesive single layer or a resin composition layer formed of resin loaded with an adhesive agent is formed thereon to serve as the backup sheet, the backup sheet is laminated and bonded on the rear surface of the copper plated board at a room temperature, and then the copper-plated board is irradiated with a carbon dioxide gas laser to be provided with a through-hole. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p>
申请公布号 JP2004228294(A) 申请公布日期 2004.08.12
申请号 JP20030013427 申请日期 2003.01.22
申请人 MITSUBISHI GAS CHEM CO INC 发明人 IKEGUCHI NOBUYUKI;AOTO HIROKI
分类号 B23K26/00;B23K26/38;B23K101/42;H05K3/00;(IPC1-7):H05K3/00 主分类号 B23K26/00
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