Semiconductor devices, and manufacturing methods, circuit substrates and electronic equipments for the same

摘要

The invention provides semiconductor devices that are excellent in mountability. The invention also provides manufacturing methods, circuit substrates and electronic equipments for the same. A method of manufacturing a semiconductor device includes mounting a semiconductor chip having electrodes on a substrate having wiring patterns, and forming conductive layers that electrically connect the electrodes and the wiring patterns in a manner to pass side surfaces of the semiconductor chip.