发明名称 |
METAL CORE MULTILAYER PRINTED WIRING BOARD |
摘要 |
<p>A metal core multilayer printed wiring board (1) composed of a laminate of an alternation of an insulating layer and a conductive layer. At least one inner layer of the laminate is a metal sheet and used as a core. The printed wiring board (1) is characterized in that a metal sheet (13) is provided under a portion where a heat-generating device (10) is mounted, the surface layer on which the heat-generating device (10) is mounted is connected to the metal sheet (13) of the inner layer through a BVH (12), and a heat dissipating layer (14) is formed in the surface layer. Without reducing the circuit mounting density, the heat generated by the heat-generating device can be efficiently dissipated outside the wiring board, and a device can be mounted on the opposite side to the side where the heat-generating device is mounted.</p> |
申请公布号 |
WO2004068923(A1) |
申请公布日期 |
2004.08.12 |
申请号 |
WO2004JP00748 |
申请日期 |
2004.01.28 |
申请人 |
CMK CORPORATION;ADVICS CO., LTD.;DENSO CORPORATION;TOHKAIRIN, HIROSHI;SAKAKIBARA, KENJI;KABUNE, HIDEKI |
发明人 |
TOHKAIRIN, HIROSHI;SAKAKIBARA, KENJI;KABUNE, HIDEKI |
分类号 |
H05K1/02;H05K3/46;(IPC1-7):H05K3/46;H01L23/36 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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