发明名称 METAL CORE MULTILAYER PRINTED WIRING BOARD
摘要 <p>A metal core multilayer printed wiring board (1) composed of a laminate of an alternation of an insulating layer and a conductive layer. At least one inner layer of the laminate is a metal sheet and used as a core. The printed wiring board (1) is characterized in that a metal sheet (13) is provided under a portion where a heat-generating device (10) is mounted, the surface layer on which the heat-generating device (10) is mounted is connected to the metal sheet (13) of the inner layer through a BVH (12), and a heat dissipating layer (14) is formed in the surface layer. Without reducing the circuit mounting density, the heat generated by the heat-generating device can be efficiently dissipated outside the wiring board, and a device can be mounted on the opposite side to the side where the heat-generating device is mounted.</p>
申请公布号 WO2004068923(A1) 申请公布日期 2004.08.12
申请号 WO2004JP00748 申请日期 2004.01.28
申请人 CMK CORPORATION;ADVICS CO., LTD.;DENSO CORPORATION;TOHKAIRIN, HIROSHI;SAKAKIBARA, KENJI;KABUNE, HIDEKI 发明人 TOHKAIRIN, HIROSHI;SAKAKIBARA, KENJI;KABUNE, HIDEKI
分类号 H05K1/02;H05K3/46;(IPC1-7):H05K3/46;H01L23/36 主分类号 H05K1/02
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