SOLID STATE IMAGE DEVICE, SEMICONDUCTOR WAFER, MODULE FOR OPTICAL DEVICE, METHOD FOR FABRICATING SOLID STATE IMAGE DEVICE, AND METHOD FOR FABRICATING MODULE FOR OPTICAL DEVICE TO PREVENT OUTER SURROUNDINGS LIKE MOISTURE, DUST, ETC. FROM INFLUENCING SURFACE OF EFFECTIVE PIXEL AREA AND REDUCE SIZE OF SOLID STATE IMAGE DEVICE

摘要

PURPOSE: A solid state image device is provided to prevent outer surroundings like moisture, dust, etc. from influencing the surface of an effective pixel area and reduce the size of a solid state image device by attaching a light transmission cover having a plane dimension smaller than that of the solid state image device to a surface of the solid state image device such that the light transmission cover confronts the effective pixel area, thereby protecting the effective pixel area. CONSTITUTION: The effective pixel area(3) is formed on a surface of the solid state image device(2). The light transmission cover(4) has a plane dimension smaller than that of the solid state image device, confronting the effective pixel area. The solid state image device and the light transmission cover are attached by an adhesion part(5).