| 摘要 |
PURPOSE: An epoxy resin composition for environmental-friendly semiconductor device package is provided, to improve flame retardancy, moisture resistant electricity reliance and high temperature long-term reliance even without using a halogen-based or antimony oxide-based flame retardant. CONSTITUTION: The epoxy resin composition comprises 4-20 wt% of at least one epoxy resin selected from the group consisting of o-cresol novolac type, biphenyl type, multifunctional type, naphthalene type and dicyclopentadiene type epoxy resins; 2-10 wt% of at least one curing agent selected from the group consisting of novolac type, xyloc type, multi-aromatic type, multifunctional type, naphthalene type and dicyclopentadiene type phenol resins; 70-92 wt% of an inorganic filler selected from the group consisting of a natural silica, a synthetic silica, a fused silica and alumina; 0.001-10 wt% of an organic phosphor nitrogen polymer compound represented by the formula 1; and 0.001-10 wt% of Mg(OH)2 or Al(OH)3, wherein R1 and R2 are identical or different each other and are an alicyclic hydrocarbon group of C3-C12 or an aromatic hydrocarbon group of C6-C12, and the hydrocarbon group contains at least one O or N; and n is an integer of 3-1,000.
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