| 摘要 |
PROBLEM TO BE SOLVED: To provide a mask for partial plating with which plating solution does not leak to a portion except the plating range needed to be plated in a lead frame 1 and a wire bonding area is secured. SOLUTION: In the mask for partial plating selectively coating the lead frame composed of a semiconductor element loading part and a lead part, the leakage of the plating solution to the side surface side can be prevented by forming an elastic material for covering the portion except the plating range of the semiconductor element loading part and the lead part. COPYRIGHT: (C)2004,JPO&NCIPI |
