发明名称 RESIN-COATED METAL FOIL AND MULTI-LAYER PRINTED CIRCUIT BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a resin-coated metal foil having excellent dielectric characteristics, excellent crack resistance, and excellent laser machining properties, and a printed circuit board. <P>SOLUTION: In the resin-coated metal foil, at least two resin layers, each of which is constituted of a resin composition containing a benzocyclobutene resin and a spherical inorganic filler are formed on at least one side a of metal foil. The multi-layer printed circuit board is obtained by a process in which the resin-coated foil is superposed on one side or both sides of an inner layer circuit board, and the obtained laminate is heated and pressed. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p>
申请公布号 JP2004223837(A) 申请公布日期 2004.08.12
申请号 JP20030013341 申请日期 2003.01.22
申请人 SUMITOMO BAKELITE CO LTD 发明人 ONOZUKA TAKESHI
分类号 B05D7/14;B05D7/24;B32B15/08;H05K3/46;(IPC1-7):B32B15/08 主分类号 B05D7/14
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