| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide copper alloy foil which is suitable for a resistance layer incorporated into a batch stacking type multilayer board for the purposes of increasing the density of a printed circuit board and reducing cost. <P>SOLUTION: The rolled Fe-Cr-Ni alloy foil for a resistor of a multilayer board has a chemical composition comprising, by mass, 12 to 26% Cr and 6 to 21% Ni, and the balance Fe , inevitable impurities, has a thickness of≤50μm, and has a volume resistivity of≥500 nΩ×m. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
