Heat sink formed of diamond-containing composite material with a multilayer coating

摘要

A module serves as a heat sink for semiconductor components. The module includes a diamond/composite substrate that carries a multilayer coating on at least one substrate surface and a housing frame made from ceramics which is soldered onto the substrate. The module excellently fulfills the demands imposed on it, namely a good ability for areally joining to the semiconductor component, a high heat transfer through the joining zone and a good electrical conductivity of the module in the joining zone.