PACKAGING MACHINE AND PACKAGING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a packaging machine suitable for manufacturing electronic parts in which the number of driving voltage supply lines are increased without increasing the dimensions of an LCD board and an FPC (flexible printed circuit) board. SOLUTION: A packaging machine 32 is provided with a stage 153 holding a plate-like component and a film-like component having a first mounting part and a first mounter mounted thereon, wherein a film-like part is bent and a second part including a second mounter is separated from a second mounting part of the plate-like component, to expose the second mounting part. A recognition part recognizes the second mounting part and the second mounter located in an isolated position separated from the second mounting part. A temporary bonding head holds the second mounter, and by moving based on a recognition result by the recognition part, positions the second mounter to the second mounting part and temporarily bond them to each other by pressure. COPYRIGHT: (C)2004,JPO&NCIPI