发明名称 |
SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can effectively inhibit a defect having ocurred in a substrate and has good performance, and its manufacturing method. SOLUTION: The semiconductor device includes: the semiconductor substrate; an element isolating region which has a trench formed on the semiconductor device and a buried dielectric film buried in the trench, a gate dielectric film formed adjacent to the element separating region, an active region where a gate electrode are formed on the gate dielectric film; and a region where at least a part of the gate electrode is positioned on the element isolating region and which is formed so that a first interface of the buried dielectric film, in which the gate electrode is positioned, is at a position above a second interface of the buried dielectric film in a second region in which the gate electrode is not located. COPYRIGHT: (C)2004,JPO&NCIPI
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申请公布号 |
JP2004228557(A) |
申请公布日期 |
2004.08.12 |
申请号 |
JP20030178863 |
申请日期 |
2003.06.24 |
申请人 |
HITACHI LTD;TRECENTI TECHNOLOGIES INC |
发明人 |
ISHIZUKA NORIO;IWASAKI TOMIO;OTA HIROYUKI;MIURA HIDEO;IKEDA SHUJI;SUZUKI NORIO;TAKAHASHI MASATO;SATO YASUO;TANAKA HIDEKI;MIMA HIROYUKI |
分类号 |
H01L21/76;H01L21/8247;H01L27/10;H01L27/115;H01L29/78;H01L29/788;H01L29/792;(IPC1-7):H01L29/78;H01L21/824 |
主分类号 |
H01L21/76 |
代理机构 |
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