| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing printed wiring board for manufacturing a printed wiring board having a firm wiring pattern with high precision by constituting so that a plating processing or an etching processing is performed after removing a resist debris remaining after development, and also to provide a resist removing device. SOLUTION: In a step 1 for forming a seed layer, a seed layer 101 is formed on a substrate 100. In a step 2 for applying a resist, a resist 102 is applied on the seed layer 101. A groove 106 corresponding to a wiring pattern is formed in the resist 102 after an exposing step 3 and a developing step 4. Thereafter, a step 5 for removing a resist debris is executed and a debris 102b in the resist 102 is ashed. Concretely, an ozone gas A is contacted with the resist 102 and also an infrared ray B is irradiated to the entire of the resist 102. A plating step 6, a step 7 for peeling the resist, and a step 8 for removing the seed layer are executed, and a printed wiring board of a desired wiring pattern can be obtained in which a copper 107 is fixed to the seed layer 101. COPYRIGHT: (C)2004,JPO&NCIPI
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