| 摘要 |
PROBLEM TO BE SOLVED: To provide a connecting method of a connector to a substrate for fixing one side solder shape(height or the like) after reflow, and for obtaining a constant contact pressure with the other side without generating a factor of connection failure. SOLUTION: In this method of connecting a connector to a through-hole 14 of a substrate by soldering, solder 28 is pushed into the through-hole 14 by a method for pressurizing one side of the through-hole 14 with a tool 32, and for printing paste solder on the substrate from the other side. A print mask 46 is removed in a status that the solder 28 is pushed into the through-hole, and the connector is inserted or pressurized from the other side, and then soldered by reflow while one side of the through-hole 14 is continuously pressurized by the jig 32. This method can be achieved by arbitrarily forming the plurality of solder shapes of one side solder connecting part. COPYRIGHT: (C)2004,JPO&NCIPI
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