| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of a semiconductor device wherein a step for taking out from a tray, a step for recognizing the position, and a step for mounting cannot be carried out continuously because a mark for recognizing the position is put on the surface of a resin package. SOLUTION: The semiconductor device has marks 24-27 for recognizing the position on the surface 223 and rear surface 224 of the resin package 22. The marks 24-27 for recognizing the position being formed on the surface 223 and rear surface 224 of the resin package 22 are arranged in substantially matching regions. The position is recognized from the rear surface under a state where the surface of the resin sealed body is sucked. Since the step for taking out from a tray, the step for recognizing the position, and the step for mounting are carried out continuously, the working process is shortened. COPYRIGHT: (C)2004,JPO&NCIPI
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