| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for inspecting disconnection of an integrated circuit by which a disconnection caused by a fine crack etc. of a semiconductor integrated circuit can be detected the health of inspectors is not damaged due to X-rays etc., the disconnection is detected in a non contact manner, expensive and large equipment such as an electronic beam generation source, a vacuum chamber and the like is not required, the disconnection is speedily and easily detected in the atmosphere, and miniaturization and manufacturing at low costs can be realized. SOLUTION: The device is provided with a voltage applying device 12 for holding the semiconductor integrate circuit 1 in a prescribed voltage applied state, an optical pulse light source 14 generating an ultra short optical pulse 2, a scanner 16 for two-dimensionally scanning the two-dimensional circuit of the semiconductor integrated circuit 2 with the ultra short optical pulse 2, an electromagnetic wave detector 18 for detecting electromagnetic waves 3 to be radiated from an irradiation position, and a disconnection detector 20 for detecting the disconnection at the irradiation position from the presence/absence or strength of the electromagnetic waves. COPYRIGHT: (C)2004,JPO&NCIPI
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