发明名称 MOLD APPARATUS FOR MOLDING RESIN
摘要 PROBLEM TO BE SOLVED: To provide a mold apparatus for molding resin, in which a part for adjusting an ejecting timing is simply taken out from a mold without disassembling it, in adjusting the ejecting timing of a specified ejecting pin for preventing a whitening phenomenon. SOLUTION: An engaging hole 17 for engaging the collar part 16 of the base of an ejecting pin 13, a stepped hole 22 for engaging a stepped sleeve 21 having a through hole 20 for a center pin at the center and a screw hole 25 to be screwed to a pressing screw 24 with a hexagonal through hole for pressing the stepped sleeve 21 to the stepped part of the stepped hole 22 via a washer 23 are formed successively in line on one ejecting plate 15 of the two ejecting plates 12, 15 fixed in an overlapped state. The tip end of a center pin 29 fixed to the base of a holding plate 27 penetrates through the through hole 20 for the center pin of the stepped sleeve 21 to come into contact with the collar part 16 of the ejecting pin 13. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004223973(A) 申请公布日期 2004.08.12
申请号 JP20030017015 申请日期 2003.01.27
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NISHITANI KENJI
分类号 B29C33/44;(IPC1-7):B29C33/44 主分类号 B29C33/44
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