发明名称 |
Room temperature printable adhesive paste |
摘要 |
An adhesive paste comprising liquid adhesive resin is partially curable to a tacky state at a temperature below the final cure temperature, and fully curable to a solid state at a temperature higher than used to reach the tacky state. In its tacky state, the adhesive paste will have sufficient strength to bond a silicon chip to a substrate with less than one kg force at room temperature. This ability is critical for thinner dies that may break with the use of greater force.
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申请公布号 |
US2004158008(A1) |
申请公布日期 |
2004.08.12 |
申请号 |
US20030361347 |
申请日期 |
2003.02.06 |
申请人 |
HE XIPING;SHENFIELD DAVID |
发明人 |
HE XIPING;SHENFIELD DAVID |
分类号 |
C08L33/04;C08L63/00;C08L79/08;C09J133/00;C09J135/00;C09J163/00;C09J179/08;(IPC1-7):C08L31/00 |
主分类号 |
C08L33/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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