发明名称 |
Electroless plating liquid and semiconductor device |
摘要 |
The present invention relates to an electroless-plating liquid useful for forming a protective film for selectively protecting surface of exposed interconnects of a semiconductor device which has an embedded interconnect structure formed by an electric conductor, such as copper or silver, embedded in fine recesses for interconnects formed in a surface of a semiconductor substrate, and also to a semiconductor device in which surfaces of exposed interconnects are selectively protected with a protective film. The electroless-plating liquid contains cobalt ions, a complexing agent and a reducing agent containing no alkali metal.
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申请公布号 |
US2004157441(A1) |
申请公布日期 |
2004.08.12 |
申请号 |
US20040774488 |
申请日期 |
2004.02.10 |
申请人 |
INOUE HIROAKI;NAKAMURA KENJI;MATSUMOTO MORIJI |
发明人 |
INOUE HIROAKI;NAKAMURA KENJI;MATSUMOTO MORIJI |
分类号 |
H01L21/302;H01L31/0328;H01L31/072;(IPC1-7):H01L31/032 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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