发明名称 |
Verfahren für die elektrische und mechanische Verbindung von mikroelektronischen Komponenten |
摘要 |
A method for the electrical and/or mechanical interconnection of components of a microelectronic system comprising at least one first component (5a, 5b; 50a-50d, 51a-51d; 70) and one second component (2; 71), provides for the formation of at least one local Joule-effect micro-heater (R) incorporated in one of the first and second components at a respective soldering point between the first component and the second component, and for the supply of electrical energy (V, 13a, 13b) to the micro-heater so as to utilize the heat produced by the micro-heater by the Joule effect to solder the first and second components at the soldering point. <IMAGE> |
申请公布号 |
DE69918551(D1) |
申请公布日期 |
2004.08.12 |
申请号 |
DE1999618551 |
申请日期 |
1999.09.17 |
申请人 |
STMICROELECTRONICS S.R.L., AGRATE BRIANZA |
发明人 |
MURARI, BRUNO;MASTROMATTEO, UBALDO;VIGNA, BENEDETTO |
分类号 |
G11B5/60;G11B21/10;H01L21/60;H01L23/34;H01R4/02;H01R43/02 |
主分类号 |
G11B5/60 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|