发明名称 WIRING BOARD INCLUDING BANK HAVING SIDE SURFACES INCLINED AT SYMMETRICAL ANGLES WITH RESPECT TO SUBSTRATE, ELECTRO-OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE
摘要 PURPOSE: A wiring board, an electro-optical device and a method of manufacturing the same, and an electronic device are provided to reduce an asymmetry of a bank. CONSTITUTION: A wiring board comprises a substrate(10); a bank(30) arranged above the substrate such that the bank defines a plurality of regions; and a conductive layer(52), and a first wiring(54) and a second wiring(62) arranged between the bank and the substrate. The bank has a top surface and a pair of side surfaces with the top surface interposed therebetween. The side surfaces of the bank are inclined at symmetrical angles with respect to the substrate. The first wiring is arranged in the position closer to the substrate than the second wiring, and the first wiring and the second wiring are disposed without a coincidence in a widthwise direction. The conductive layer is arranged in the position closer to the substrate than the second wiring, and the conductive layer and the second wiring are disposed with a coincidence in a widthwise direction.
申请公布号 KR20040071595(A) 申请公布日期 2004.08.12
申请号 KR20040005003 申请日期 2004.01.27
申请人 SEIKO EPSON CORPORATION 发明人 AOKI KOJI
分类号 H05B33/22;B32B3/00;B32B15/00;G09F9/00;G09F9/30;G09G3/00;G09G3/30;H01L27/32;H01L51/50;H05B33/00;H05B33/02;H05B33/10;H05B33/12;H05B33/14;H05K3/00;(IPC1-7):H05B33/22 主分类号 H05B33/22
代理机构 代理人
主权项
地址