发明名称 WIRING BOARD AND LIGHT EMITTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a wiring board that can efficiently radiate heat generated from a heating component when mounting the heating component such as a light emitting element, has excellent heat resistance and light resistance, further facilitate mechanical machining and can be made thin. <P>SOLUTION: The wiring board is provided with a metal-made base substance 3, an insulating layer 5 consisting of ceramics provided for the base substance 3, and a conductor wiring 4 provided so as to be in contact with the insulating layer 5 and not to be in contact with the base substance 3. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004228170(A) 申请公布日期 2004.08.12
申请号 JP20030011675 申请日期 2003.01.20
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 NAKAGAWA TERUO;NAKANISHI HIDEO
分类号 H01L33/56;H01L33/62;H01L33/64 主分类号 H01L33/56
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