| 摘要 |
PROBLEM TO BE SOLVED: To enhance production yield while suppressing the falling accident of a printed circuit board at the time of automatic packaging by facilitating removal of the printed circuit board from a substrate for packaging and reducing warp of the substrate for packaging. SOLUTION: The substrate 10 for packaging comprises: first printed circuit boards 12, 12, ... and second printed circuit boards 14, 14, ... punched from a print wiring mother board and fitted in the original holes; a frame 16 obtained by punching the first printed circuit boards 12, 12, ... and second printed circuit boards 14, 14, ... from the print wiring mother board such that the outer circumference of the first printed circuit boards 12, 12, ... and second printed circuit boards 14, 14, ... touches a common tangent; and one or more V cuts 18a-18d formed in the frame 16 on the common tangent or in the vicinity thereof along a line parallel with the common tangent. COPYRIGHT: (C)2004,JPO&NCIPI
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