| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for drying a substrate that can prevent the occurrence of a water mark and has satisfactory throughput even in the substrate having a surface, where the strength of hydrophilic properties is different. SOLUTION: In a substrate treating method for removing a liquid DIW adhering onto the surface of a substrate W, the surface of the substrate W has portions 10, 11 where the strength of hydrophilic properties is different each other. Rotating the substrate W removes the liquid DIW from the portion 10 whose hydrophilic properties are weak. Increasing a rotational speed for rotating the substrate W removes the liquid DIW from the portion 11 whose hydrophilic properties are strong. COPYRIGHT: (C)2004,JPO&NCIPI
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