| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame capable of preventing disconnection of a bonding wire and exposure of a part of a die pad from a resin sealed part by eliminating inclination of the die pad during resin sealing, and to provide a resin-sealed semiconductor device and its manufacturing method. SOLUTION: The resin-sealed semiconductor device in which a semiconductor chip is mounted on the surface of the die pad, and an outside lead is exposed from the resin sealed part of the die pad rear face side of the die pad is characterized in that a support part, on which a pin supporting the die pad contacts, is formed on the rear face of the die pad during resin sealing. COPYRIGHT: (C)2004,JPO&NCIPI
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