| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a tape carrier without generating a conduction inferiority between the land of a package and the terminal of a matter to be mounted when mounting the package punched for every circuit pattern from the tape carrier. SOLUTION: A laminate in which an adhesive 21 is provided on the surface of a tape-like insulating film 20 and a protective film is provided on the front and the rear faces of the tape-like insulating film, is prepared. At first, a via hole 23 or the like is formed on the insulating film. Next, a conductor layer 24 is provided on the insulating film in place of the protective film. Next, a conductive coat 26 is provided on an inner wall of the via hole of the insulating film and the conductor layer of the inside of the via hole. Next, a metal plated layer 27 is provided on the surface of the conductive coat of the inner wall of the via hole and the conductor layer of the inside of the via hole. Next, a required part of the conductor layer is etched to provide a circuit pattern. Finally, a finished plated layer is provided on the surface of the circuit patter to obtain the tape carrier. COPYRIGHT: (C)2004,JPO&NCIPI
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