发明名称 PACKAGE FOR HOUSING LIGHT EMITTING ELEMENT AND LIGHT EMITTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To make a light emitting element preventable from damaged or from electrically mulfunctioning by dispersing well heat generated at the light emitting element to the outside of a package for housing the light emitting element. <P>SOLUTION: A recess 2a for housing a light emitting element 3 is formed on the upper surface of a base body 1 consisting of a sintered body of aluminum nitride. On the bottom surface of the recess 2a, a mounting part 1a composed of a metallized layer on which the light emitting element 3 is mounted is provided. A wiring layer 7b comprising the matallized layer to which an electrode of the light emitting element 3 is electrically connected is formed near the mounting part 1a. The mounting part 1a is provided with a first non conductor-formation part 8a which is smaller than the lower surface of the light emitting element 3, and the wiring layer 7b is provided with a second non conductor-formation part 8b. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004228413(A) 申请公布日期 2004.08.12
申请号 JP20030015992 申请日期 2003.01.24
申请人 KYOCERA CORP 发明人 MAEKAWA YOSHINORI
分类号 H01L33/56;H01L33/60;H01L33/62;H01L33/64 主分类号 H01L33/56
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