发明名称 PACKAGE FOR HOUSING LIGHT EMITTING ELEMENT AND LIGHT EMITTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a package for housing a light emitting element which efficiently disperses the heat generated with the light emitting element for a higher heat radiation effect, and is usable as a display device for an extended period, with no metal layer coated on the inner surface of a recess being peeled. <P>SOLUTION: The package for housing a light emitting element has a plurality of recess sections 4 for housing a light emitting element 3 arrayed vertically and horizontally on the upper surface of an insulating base body 1. A recess 8 is formed in such part of the lower surface of the insulating base body 1 as corresponds to each the recess section 4. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004228241(A) 申请公布日期 2004.08.12
申请号 JP20030012721 申请日期 2003.01.21
申请人 KYOCERA CORP 发明人 CHITOSE TOSHIYUKI;MORIYAMA YOSUKE
分类号 H01L33/60;H01L33/64 主分类号 H01L33/60
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