发明名称 |
SCANNER DEVICE AND LASER MACHINING DEVICE |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a scanner device in which a target orbit following machining is realized at a high speed and with high accuracy. <P>SOLUTION: In a servo control circuit 3 which controls the actions of an X-axis scanner 1 which positions a mirror 12 and a Y-axis scanner 2 which positions a mirror 22, the sine wave response of the feedback control of respective axes is executed at a specified frequency and a gain characteristic and a phase characteristic are estimated. The processing calculation is executed with a microprocessor 32 prior to machining, and estimated results for both axes are stored as data for every frequency. In a machining process, the amplitude and the phase of the sine wave of the target orbit are so corrected to cancel respective characteristics by using the estimated results of the gain characteristic and the phase characteristic. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
申请公布号 |
JP2004226499(A) |
申请公布日期 |
2004.08.12 |
申请号 |
JP20030011399 |
申请日期 |
2003.01.20 |
申请人 |
HITACHI VIA MECHANICS LTD |
发明人 |
TOYAMA SOICHI;SAKAMOTO ATSUSHI;OTSUKI HARUAKI;OKUBO YAICHI |
分类号 |
G02B26/08;B23K26/08;G02B26/10;(IPC1-7):G02B26/10 |
主分类号 |
G02B26/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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