发明名称 |
Soldering method and method for manufacturing component mounting board |
摘要 |
Deterioration of a joining portion caused by a Cu-Zn compound layer is prevented by forming compound or alloy of Cu and Sn at the joining interface including a Cu surface to be a joining portion of a circuit board and an electronic component and then carrying out soldering by use of a soldering material containing Sn and Zn in composition.
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申请公布号 |
US2004155097(A1) |
申请公布日期 |
2004.08.12 |
申请号 |
US20040770292 |
申请日期 |
2004.02.02 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
YAMAGUCHI ATSUSHI;HIRANO MASATO |
分类号 |
B23K35/00;B23K35/14;B23K35/26;H05K3/24;H05K3/34;(IPC1-7):B23K35/12 |
主分类号 |
B23K35/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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