发明名称 SOCKET ASSEMBLY FOR TESTING IC CHIP, IC CHIP USING THE SAME, AND TESTER USING THE SOCKET ASSEMBLY
摘要 PROBLEM TO BE SOLVED: To provide a socket assembly for testing an IC chip, capable of improving reliability for electrical characteristics inspection by improving efficiency by selecting one of direct/indirect connection between a test board and the IC chip in accordance with its characteristics, and reducing the load capacity between probe pins through direct contact and terminals, the IC chip which uses the same, and a tester which uses the socket assembly. SOLUTION: The assembly comprises a guide block installed on a test board, having terminals around the test board and forming a regional range facing the terminals, while the IC chip is formed removably from/to above; a guide part provided in the inside of the guide block facing the regional range and guiding the lowering position of the IC chip so as to directly connect each probe pin with the terminals, respectively; and a pressure plate pressing the probe pins so as to be connected to each corresponding terminal with pressure projections equipped under the pressure plate. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004226398(A) 申请公布日期 2004.08.12
申请号 JP20030381824 申请日期 2003.11.11
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 KIM JEONG-YANG;LIM YOUNG-SOON;PARK BYUNG-WOOK;LEE JUNG-MU;OH JUNG-HOON
分类号 G01R31/26;G01R1/073;H01R13/24;H01R33/76;(IPC1-7):G01R31/26 主分类号 G01R31/26
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