| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating method and a plating device with which the applied electric potential distribution is freely and finely adjusted at a low cost when performing plating on a substrate surface to be plated, and a plating film of uniform film thickness is deposited on the substrate surface without requiring any complicated operation method. SOLUTION: In the plating device in which an anode 14 and a substrate W to be plated are disposed facing each other and immersed in a plating solution 10 in a plating tank 11 holding the plating solution 10. An adjustment plate 21 is disposed between the anode 14 and the substrate W, and the substrate W is plated by performing energization between the anode 14 and the substrate W, the adjustment plate 21 is formed of a dielectric material, and a through hole group distribution adjustment means having a through hole group consisting of a large number of through holes 24 penetrated from the surface on the substrate side to the anode side surface to adjust the condition of distribution of the through hole group of the adjustment plate 21 is provided. COPYRIGHT: (C)2004,JPO&NCIPI
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