发明名称 METHOD AND APPARATUS FOR DIE PICKUP
摘要 PROBLEM TO BE SOLVED: To provide a die pickup apparatus which realizes stable pickup by automatically changing a condition of picking up a die. SOLUTION: During moving of a rotation panel 20 to a part suction station, the die which has to be picked up on a die supplying table 27 is imaged by a recognition camera 17 to recognize the position of the die D with a recognition processor. When the result of this recognition processing is defective standing etc. of the die, a CPU judges it to be defective recognition. In this case, the CPU controls the apparatus so that a recognition NG continuity counter may be increased by "1", the die may be scrapped into a scrap box when this does not amount to N-times which is the number of set times, the die pickup operation may be shifted to the next one, and a thrust-up amount of a thrust-up pin may be increased or a thrust-up speed may be lowered by one pitch whenever following die pickup operation is continued N-times. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004228255(A) 申请公布日期 2004.08.12
申请号 JP20030012905 申请日期 2003.01.21
申请人 HITACHI HIGH-TECH INSTRUMENTS CO LTD 发明人 AKAISHI KOUJI;WATANABE AKIO
分类号 H01L21/67;H01L21/52;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/67
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