| 摘要 |
PROBLEM TO BE SOLVED: To allow a plurality of semiconductor devices to be precisely aligned with a mounting part and a lid and to be mounted on an insulating board, so that a light receiving part and a lid of an optical semiconductor device, for example, are aligned precisely each other, to suppress the scattered light that acts as noise from entering the light receiving part of the optical semiconductor device. SOLUTION: The package for housing the semiconductor device is provided with an insulating board 1 where a plurality of mounting parts for a semiconductor device 3 comprising a conductor layer are formed side by side on its upper surface, and a metal frame 2 which is jointed to the outer peripheral part of the upper surface of the insulating board 1 to enclose the plurality of mounting parts. A protruding part 2a that protrudes further inward than the mounting part is provided to the part between the mounting parts of the metal frame 2. COPYRIGHT: (C)2004,JPO&NCIPI
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