发明名称 INJECTION MOLDING IMAGE SENSOR AND ITS PRODUCING PROCESS
摘要 PROBLEM TO BE SOLVED: To provide an injection molding image sensor and its producing process. SOLUTION: The injection molding image sensor comprises a plurality of metal pieces each having a first plate, a second plate and a third plate presenting a U-shape and arranged mutually, an injection molding structure for forming a groove by covering these metal pieces, forming a signal input end by injection molding to cover a part of the first plate of these metal pieces and to expose another part, forming a signal output end by exposing the second plate from the bottom face, and exposing the third plate from the side face, an image sensing chip arranged in the recess of the injection molding structure and provided with a plurality of bonding pads thereon, a plurality of wires for connecting the bonding pads of the image sensor chip electrically with the signal input ends of the first plate of these metal pieces, and a translucent layer provided at the upper end of the injection molding structure to cover the image sensor chip. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004228303(A) 申请公布日期 2004.08.12
申请号 JP20030013613 申请日期 2003.01.22
申请人 KINGPAK TECHNOLOGY INC 发明人 SHIE JR-HUNG;GO SHISEI;CHEN BING-GUANG;SAI SHOSETSU
分类号 B29C45/14;H01L23/08;H01L27/14;H04N5/335;(IPC1-7):H01L27/14 主分类号 B29C45/14
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