| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent the generation of peeling or the like on a joint interface between a joint member or a sealing resin on the upper major surface of a semiconductor device and on the upper surface of a substrate and the upper surface of the semiconductor device and on the joint interface between the joint member or the sealing resin and the upper surface of the substrate, when the semiconductor apparatus is soldered to an external electric circuit board or the like, and to make contamination or dust hardly adhere to a contact detection sensor part. <P>SOLUTION: The semiconductor apparatus includes the substrate 1 in which first and second through-holes 1a and 1b are formed and in which an electrode pad 6 is formed around an upper side opening of the first through-hole 1a, the semiconductor device 3 whose upper major surface is bonded to the lower surface of the substrate 1 so that an electrode 5 on the upper major surface is disposed opposedly to the opening of the first through-hole 1a at the lower surface of the substrate 1 and that the contact detection sensor part 4 is disposed opposite the opening of the second through-hole 1b on the lower surface of the substrate 1, a conductive connection line for electrically connecting the electrode 5 and the electrode pad 6 through the first through-hole 1a, and a resin 2 which covers the electrode 5, the conductive connection line, and the electrode pad 6 and which is charged into the first through-hole 1a. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
